|浙大論壇 > 招聘欄目 > 瀏覽當前帖子||最新帖子進站窗口排行在線會員隱藏左側欄|
|【Intel 上海實習】Electronic Package Engineering Internship Locat|
|【返回本版】 【發表帖子】 【回復帖子】||瀏覽量 314 回帖數 0|
intel_bbs 等級 ★
樓主 發表于 2021/3/1 16:33:35 編 輯
【Intel 上海實習】Electronic Package Engineering Internship
?The Non-Volatile Memory group in Shanghai PRC is looking for a full-time paid intern to help support Package path finding development team projects, including Silicon / package interaction assembly process solutions, DOEs executions and coordination with Fab, Intel assembly subcontractors to fulfill assembly process development project objectives, ensure project schedules and on-time qualification to achieve new product and package transfer to high volume manufacturing. Additional project responsibilities will be added once project begins.
The candidate must be pursuing a BS degree in Materials Science, Metallurgical Engineering, Ceramic Engineering, Chemical Engineering, Mechanical Engineering or related field.
The candidate must have the unrestricted right to work in the U.S. without requiring sponsorship.
experience/knowledge in electronic materials processing.
experience/knowledge experience in IC fabrication process.
experience/knowledge in electronic packaging materials and/or assembly process.
experience/knowledge in material sample polish and grind.
experience/knowledge in fast paced environment.
Pls send your resume to email@example.com
|論壇幫助 友情鏈接 會員認證刪帖申請 聯系我們|